Ivy Bridge-E to use solder instead of paste? If you were disappointed by the overclocking ability of the Intel’s Ivy Bridge and their latest architecture Haswell, you might want to check these pictures out.
User “Toppc” on the Taiwanese forum Coolaler is apparently in possession of at least one Ivy Bridge-E Core i7 4960x, and has taken the liberty of delidding it for his fellow members. This is done by extreme overclockers to replace the paste-type thermal interface material began using when manufacturing Ivy Bridge, and continuing with Haswell. One CPUs prior to these, solder was used between the CPU and the heat spreader (the part that actually makes contact with the heatsink).
The pictures of his newly ruined pre-release $1000 CPU show that solder was used to attach the heat plate to the CPU die. This is significant because it shows us that Intel continues to use solder on certain product segments, even after switching to paste on mainstream desktop SKUs. Since Ivy Bridge-E is essentially a server CPU transplanted to high end desktop PCs, this can be interpreted as an acknowledgement that for best thermal performance, solder is the better choice.
Ivy Bridge-E is expected to be released in September, and we have some rumored specs (along with Haswell-E) to share before fully covering the CPU at that time.